China's semiconductor industry leaders have endorsed the country's 15th five-year plan, which emphasizes boosting the domestic chip sector to reduce reliance on foreign technology.
The draft plan calls for strengthening both mature and advanced chip manufacturing processes, accelerating development of key equipment and materials, and advancing high-performance processors and AI chips.
It specifically highlights wide-bandgap semiconductors and aims for breakthroughs across the entire semiconductor value chain, alongside enhanced academic and talent development programs.
The main topics covered are China's semiconductor industry policy, technological priorities within the five-year plan, and industry leader endorsements.
China’s chip bosses endorse semiconductor push in next 5-year plan
Industry leaders say the draft blueprint underscores Beijing’s determination to reduce reliance on foreign technology.
China’s semiconductor entrepreneurs – including artificial intelligence chipmaker Cambricon Technologies and testing-and-packaging leader Tongfu Microelectronics – have voiced support for the country’s 15th five-year plan, which places renewed emphasis on the chip industry as a cornerstone of Beijing’s technology ambitions.
“National policy direction and planning are very well designed,” said Chen Tianshi, founder and CEO of Beijing-based Cambricon.
Speaking on the sidelines of the opening of China’s annual parliamentary meetings last Thursday at the Great Hall of the People, Chen – a member of the Chinese People’s Political Consultative Conference – told the South China Morning Post that “for companies like ours, the key is to focus on doing our jobs well”.
China’s 15th five-year plan, currently under review during the “two sessions” annual political gathering, makes multiple references to “integrated circuits” and “chips”.
The draft calls for efforts to “refine and strengthen mature-node, enhance capabilities in advanced process technologies, accelerate development of key equipment, materials and components, and advance high-performance processors and high-density memory”.
It singles out the wide-bandgap semiconductor industry – based on materials such as silicon carbide and gallium nitride – as well as high-performance AI chips.
The blueprint calls for breakthroughs in critical technologies across the entire semiconductor value chain, as well as stronger academic programmes and talent training.